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(IT-NEWSWIRE.COM, December 01, 2021 ) According to the new market research report "Thin-Film Encapsulation Market (TFE) by Application (OLED Display, Lighting, Thin-Film Photovoltaics), Deposition Technology (Inorganic Layers (PECVD, ALD) and Organic Layers (Inkjet Printing and VTE)), and Geography - Global Forecast to 2023", The thin-film encapsulation market for materialsis expected to grow from USD 31.7 Million in 2018 to USD 101.1 Million by 2023, at a CAGR of 26.1% between 2018 and 2023.
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The thin-film encapsulation market for materialscovers the thin-film organic and inorganic barriers used at the manufacturing level of flexible OLED displays, flexible OLED lighting, thin-film photovoltaics, and other products. The need for thin-film barriers in flexible and organic devices, trend of thin-film encapsulation using inkjet printing technology, and rapid adoption of flexible OLED displays for smartphones and smart wearables significantly drive the market growth. The growing investments in the OLED technology and manufacturing facilities and rising adoption of thin-film solar cells are likely to provide lucrative opportunities for the market players in the near future.
Rising demand for flexible OLED displays and flexible OLED lighting solutions is driving the growth of thin-film encapsulation market for materials
OLED displays accounted for the largest share of the thin-film encapsulation market for materials, in terms of value, in 2017. Samsung SDI and LG Chem develop thin-film encapsulation materials for flexible OLED displays. These companies are also working with thin-film encapsulation equipment suppliers, such as Kateeva and Applied Materials. The thin-film encapsulation market for materials in OLED lighting applications is expected to grow at the highest CAGR of 31.8% during the forecast period.
APAC is expected to hold the largest market share between 2018 and 2023
APAC accounted for the largest share of the thin-film encapsulation market for materials in 2017. Major display panel and brand product manufacturers are based in China, Japan, Taiwan, South Korea, and Hong Kong. South Korea witnessed the highest demand for thin-film encapsulation materials in 2017 owing to presence of industry leaders such as Samsung and LG Display in the country. Further, the demand for thin-film encapsulation materials from China is expected to increase rapidly during 2018–2023 as various Chinese players, such as BOE Technology and CSOT, are planning to construct facilities to manufacture flexible OLED panels.
The leading suppliers of thin-film encapsulation equipment and materials in the market are Samsung SDI (Novaled) (South Korea), LG Chem (South Korea), Universal Display Corp. (UDC) (US), Applied Materials (US), 3M (US), Veeco Instruments (US), Kateeva (US), Toray Industries (Japan), BASF (Rolic) (Germany), Meyer Burger (Switzerland), Aixtron (Germany), Bystronic Glass (Germany), AMS Technologies (Germany), and Angstrom Engineering (Canada). Key innovators profiled in this report include Beneq (Finland), Encapsulix (France), Lotus Applied Technology (US), Vitriflex (US), and Picodeon (Finland).
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