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(IT-NEWSWIRE.COM, October 19, 2015 ) Wafer-level packaging and Dielevel Packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.
Technavio's analysts forecast the global die-level packaging equipment market to grow at a CAGR of 1.24% during 2014-2019.
This report covers the present scenario and growth prospects of the global die-level packaging equipment market for 2015-2019. To calculate the market size, the report considers revenue generated from the sales of die-level packaging equipment worldwide. However, the report does not consider the following while calculating the market size:
• Support or maintenance services offered for/with die-level packaging equipment
• Components used in the production of die-level packaging equipment
• Aftermarket sales of die-level packaging equipment
Global Die-level Packaging Equipment Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.
Key Regions
• Americas
• APAC
• EMEA
Key Vendors
• ASM International
• BE Semiconductor Industries
• DISCO
• Kulicke & Soffa Industries
Other Prominent Vendors
• Advantest
• Cohu
• Hitachi High-Technologies
• Shinkawa
• TOWA
Market Driver
• Rise in Demand for Smartphones and Tablets
• For a full, detailed list, view our report
Market Challenge
• Rapid Changes in Technology
• For a full, detailed list, view our report
Market Trend
• Short Replacement Cycle of Portable Electronic Devices
• For a full, detailed list, view our report
Get sample copy of this report @ http://www.bigmarketresearch.com/report-enquiry/320973
Table Of Contents
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
04. Market Research Methodology
05. Introduction
06. Industry Overview
07. Market Landscape
08. Geographical Segmentation
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and Their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Trends and Their Impact
16. Vendor Landscape
17. Key Vendor Analysis
18. Other Reports in this Series
Big Market Research
James Jordan
+ 1-800-910-6452
james@bigmarketresearch.com
Source: EmailWire.Com 
Source: EmailWire.com
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