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(IT-NEWSWIRE.COM, March 08, 2017 ) According to a new market research report “Smart Packaging Market by Technology (Active, Intelligent, and MAP), Industry Vertical (Food & Beverages, Automotive, Healthcare, Personal Care, and Others) & Geography - Global Forecast to 2020”.
The smart packaging market size is expected to reach $39.7 Billion, growing at a CAGR of 4.8% from 2014 to 2020.
Browse 73 market data tables and 72 figures spread through 162 pages and in-depth TOC on “Smart Packaging Market - Global Forecast to 2020".
http://www.marketsandmarkets.com/Market-Reports/smart-packaging-market-196217014.html
Early buyers will receive 10% customization on reports.
In the packaging industry, smart packaging is used for various applications. These include food & beverages, automotive, healthcare, and personal care. It offers many advantages over conventional packaging, such as increased shelf life, reduced counterfeiting, increased safety coupled with low cost, and easy implementation, among others.
The report covers the smart packaging market on the basis of different technologies and packaging types. It also segments the smart packaging market on the basis of various applications, such as food & beverages, automotive, healthcare, and personal care, and geographically into the Americas, Europe, Asia-Pacific (APAC), and Rest of the World (RoW).
Smart packaging market statistics have been included pertaining to various aspects such as technology, applications, and geography. The major types of technologies covered in the report are MAP, moisture control, gas scavengers, smart labels and time, and temperature indicators.
Apart from the market statistics, the report also includes qualitative analysis such as value chain with detailed process flow diagrams; market dynamics such as drivers, restraints, and opportunities; winning imperatives; and industry trends for the overall smart sensor market.
Some of the key players in the industry that have been covered in this report are 3M (U.S.), TempTime Corporation (U.S.), PakSense (U.S.), American Thermal Instruments (U.S.), Avery Dennison (U.S.), R.R. Donnelly Sons & Company (U.S.), BASF SE (Germany), International Paper (U.S.), Stora Enso (Finland), Thin Film Electronics ASA (Norway), Huhtamaki Group (Finland), and Smartrac N.V. (The Netherlands), among others.
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Mr. Rohan
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Source: EmailWire.Com 
Source: EmailWire.com
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