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(IT-NEWSWIRE.COM, January 13, 2018 ) According to the new market research report "Next-Generation Memory Market by Technology (Volatile (HMC and HBM), and Nonvolatile (MRAM, FRAM, RERAM, 3D XPoint, NRAM)), Wafer Size (200 mm, 300 mm, and 450 mm), Application, and Geography - Global Forecast to 2023", the next-generation memory (NGM) market is expected to reach from 2.35 Billion in 2017 to USD 9.68 Billion by 2023, at a CAGR of 26.54% between 2017 and 2023. The NGM market has a huge potential across various applications, such as consumer electronics, enterprise storage, and industrial. The major factor driving the NGM market across the world is the big data demand for increasing demand for enterprise storage applications. The need for high bandwidth, low power consumption, and highly scalable memory device for technologies such as artificial intelligence (AI), Internet of Things (IoT), and Big Data is also driving the NGM market.
Browse 70 Market Data Tables and 49 Figures spread through 173 Pages and in-depth TOC on "Next-Generation Memory Market - Global Forecast to 2023"
https://www.marketsandmarkets.com/Market-Reports/Memristor-Memory-Market-632.html
Early buyers will receive 10% customization on reports.
The market for nonvolatile memory held a larger share of the NGM market in 2016. Nonvolatile memories, such as ReRAM, STT-MRAM, and 3D XPoint, offer better speed and improved performance compared to volatile memory, such as DRAM and SRAM, along with the higher storage densities.
The NGM market for the consumer electronics application is expected to grow at the highest CAGR between 2017 and 2023. The emerging memory technologies are mostly driven by connected and wearable devices. Smartphones, digital cameras, gaming devices, and other consumer electronics devices also need memory technologies in bulk. With the growing consumer electronics market, the demand for emerging memory technologies is also expected to increase.
Download PDF Brochure : https://www.marketsandmarkets.com/pdfdownload.asp?id=632
450 mm wafer fabs can accommodate more dice per wafer leading to the more storage capacity than that of 300 mm wafer fabs.
Additionally, with the increasing wafer cost and feature dimensions, 450 mm wafers would be the most preferred choice for the next-generation memory technologies.
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Source: EmailWire.Com 
Source: EmailWire.com
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