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(EMAILWIRE.COM, August 01, 2019 ) Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
The market is majorly driven by the increasing demand from the microelectronics industry verticals. In this modern era, the disruptiveness of technology innovations in the consumer electronics sector is fast paced and the innovations are becoming easily accessible and affordable. The growing consumer needs, emergence of many new start-ups, IP infringement issues, and strong competition are forcing manufacturers to innovate and continuously asses growth opportunities.
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China is by far the largest consumer of semiconductors; it accounts for about 45 percent of the worldwide demand for chips, used both in China and for exports. But more than 90 percent of its consumption relies on imported integrated circuits. Integrated-circuit companies in China entered the semiconductor market late—some two decades after the rest of the world—and have been playing catch-up ever since in an industry in which success depends on scale and learning efficiencies. The Chinese government made several attempts to build a local semiconductor industry, but none really took hold. Now, however, things are changing on both the business and policy fronts.
The leading companies own the advantages on better performance, more abundant product’s types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, the slow downward price trend in recent years will maintain. As competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
Over the next five years, Publisher projects that Plating for Microelectronics will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.
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This report presents a comprehensive overview, market shares, and growth opportunities of Plating for Microelectronics market by product type, application, key manufacturers and key regions.
To calculate the market size, Publisher considers value and volume generated from the sales of the following segments:
Segmentation by product type:
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Segmentation by application:
MEMS
PCB
IC
Photoelectron
Others
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Some Points From Table of Content:
1 Scope of the Report
2 Executive Summary
3 Global Plating for Microelectronics by Players
4 Plating for Microelectronics by Regions
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
Continued…
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Hector Costello
+1 (214) 884-6817
sales@orbisresearch.com
Source: EmailWire.Com 
Source: EmailWire.com
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